Reliability of Through Hole Reflow
 

There are a range of different tests that can be conducted on through hole parts to assess their solder joint reliability with both tin/lead and lead-free alloys. Another consideration is the impact of mixed alloys, which is more likely to occur with traditional through hole components. As has been seen in the industry, through hole connections are extremely robust compared to surface mount, but what if we are using through hole reflow on single-sided boards? Results will be provided on pull testing and thermal cycling of different joints and different solder alloys.

Topics will include:

Testing of joints
Failure modes
Tin/lead or lead-free