Solder Joint Inspection and Quality Control
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X-ray examination of through hole intrusive reflow solder joints

The through hole solder joints produced by intrusive reflow can be as reliable as wave, selective or manual soldering provided care is taken during process introduction and the production staff have the correct support with good inspection criteria. There are differences in the visual inspection criteria with pin in paste, but the standards that can be achieved well exceed the IPC Level 3 criteria. Manual and automatic optical inspection can be used along with x-ray to analysis for those solder joints not totally visible to the naked eye..


Topics will include:
- Solder paste volume checks
- Inspection criteria, optical and x-ray
- Checking solder finish and solder mask compatibility
- Component damage