Temperature Profiling for Pin In Paste Reflow
 

Conventional components are not often designed to meet the temperature requirements of surface mount parts, so minimizing the temperate they are exposed to during manufacture is important to success. Most engineers should be very familiar with temperature profiling in conventional and vapour phase soldering processes. Normally, through hole parts have a larger mass, so they are more difficult to profile, this must be conducted correctly to achieve the highest yields.

Topics will include:

Mounting thermocouples
Adjusting temperatures for through hole
Solder paste loss
Flux exhaustion
Reflow process capability