Reflow Soldering

Through hole reflow can be successfully conducted by convection or vapour phase reflow with either tin/lead or lead-free alloys. Today, many products are double-sided reflow, allowing through hole components to be soldered in one or both of these two steps. In the case of solder alloys, there are a number of options available when selecting lead-free solders, some of which can be processed below the reflow temperature of common tin/lead solders.

Although most through hole parts do have a higher mass than other surface mount components using modern reflow processes, the delta T between small and large body components can still be kept to a minimum.

Topics will include:
Profile setting
- Delta T
- Air or nitrogen
- Vapour loss