Pin In Hole Reflow PCB Design Guidelines

Design for pin in hole intrusive reflow is not difficult. Like most things, it’s attention to detail. An engineer needs to look at the hole-to-lead ratio between the component termination and the plated through hole to maximize hole fill. However it’s not difficult to exceed the minimum through hole requirements of the IPC 610 Level 3.

Solder mask compatibility with the solder paste is also down to the design engineer to specify when coordinating his PCB specification for procurement. Good collaboration between fabricator and the assembly service provider is important to maintain high yields.

Topics will include:
Laminate types
- Solder mask
- Surface finish
- Hole and pad sizes