PIHR Manufacturing Defects – Causes and Cures
 

There are potential process issues with PIHR, but none that are show stoppers, provided you pay attention to detail during the implementation of the process. This chapter will provide examples of each of the common process problems and solutions. It will include issues associated with the components, PCBs, solder paste, incorrect profiling and limited inspection criteria or training. The section will include optical, x-ray and microsections from the author’s extensive library.

Topics will include:
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Solder voids
- Solder balls
- Flux contamination
- Solder spitting