Reflow soldering of through hole components can simplify the entire assembly process for companies running tin/lead or lead-free and continue to maintain the quality and reliability of the products being built. The reflow-only process can also eliminate the cost and waste associated with wave and selective soldering. By eliminating two processes, floor space and energy costs can be reduced--a definite advantage to the end user.
Pin in Hole Reflow, or PIHR, is just one of the common names give to this assembly process. However, around the world there are many others, like:
Pin in paste
In simple terms, the process is achieved by placing a controlled amount of solder paste onto the PCB surface and into a plated through hole, adding a through hole lead and then heating the paste to reflow temperature. The result is a solder joint that has the same mechanical and electrical performance as any produced by selective, manual or wave soldering.